News
IMOS
33.56
+0.72%
0.24
ChipMOS Sets February 24 Call for 2025 Results
TipRanks · 4d ago
ChipMOS SCHEDULES FOURTH QUARTER AND FULL YEAR 2025 FINANCIAL RESULTS CONFERENCE CALL
PR Newswire · 4d ago
Weekly Report: what happened at IMOS last week (0126-0130)?
Weekly Report · 6d ago
Weekly Report: what happened at IMOS last week (0119-0123)?
Weekly Report · 01/26 09:26
ChipMOS Posts Sharp Profit Rebound as TWSE Triggers Enhanced Disclosure
TipRanks · 01/20 11:29
Weekly Report: what happened at IMOS last week (0112-0116)?
Weekly Report · 01/19 09:29
12 Information Technology Stocks Moving In Friday's Pre-Market Session
Benzinga · 01/16 12:05
Weekly Report: what happened at IMOS last week (0105-0109)?
Weekly Report · 01/12 09:28
Midday Fly By: Job growth comes in below forecasts in December
TipRanks · 01/09 17:00
ChipMOS Posts Double-Digit Revenue Growth in December and Q4 2025 on Memory Demand
TipRanks · 01/09 11:28
ChipMOS Q4 revenue grows nearly 21% Y/Y
Seeking Alpha · 01/09 11:26
ChipMOS reports Q4 revenue $207.9M vs. $172.1M last year
TipRanks · 01/09 11:10
ChipMOS REPORTS 23.8% YoY INCREASE IN DECEMBER 2025 REVENUE; 4Q25 REVENUE INCREASES 20.8% YoY
PR Newswire · 01/09 11:00
Weekly Report: what happened at IMOS last week (1229-0102)?
Weekly Report · 01/05 09:27
Weekly Report: what happened at IMOS last week (1222-1226)?
Weekly Report · 12/29/2025 09:26
Weekly Report: what happened at IMOS last week (1215-1219)?
Weekly Report · 12/22/2025 09:26
ChipMOS Fined for Environmental Violation in December 2025
TipRanks · 12/16/2025 11:29
Weekly Report: what happened at IMOS last week (1208-1212)?
Weekly Report · 12/15/2025 09:28
ChipMOS Reports Significant Revenue Growth in November 2025
TipRanks · 12/10/2025 11:32
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About IMOS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.