TSMC's system-level wafer technology will usher in a major breakthrough. The company said that the chip-stacked version using CoWOS technology is expected to be ready in 2027 to integrate SoIC, HBM and other components to create a powerful wafer-level system with computing power comparable to data center server racks or even entire servers.

Zhitongcaijing · 04/26/2024 06:47
TSMC's system-level wafer technology will usher in a major breakthrough. The company said that the chip-stacked version using CoWOS technology is expected to be ready in 2027 to integrate SoIC, HBM and other components to create a powerful wafer-level system with computing power comparable to data center server racks or even entire servers.